Broadcom aims to sell 1M 3D stacked chips by 2027: report

Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.

Exclusive: Broadcom expects to sell 1 million 3D stacked chips by 2027

Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an executive told Reuters on Wednesday.

Nebius: More Than GPUs - A Hidden AI Platform The Market Is Missing

Higher average selling prices, and a 100% attach rate for AI cloud software highlight Nebius' sticky business model. Find out why NBIS stock is rated a buy.
Semiconductor Engineering

AI Starting To Simplify Design Of Programmable Logic

Designing and deploying DSPs FPGAs aren’t the only programmable hardware option, or the only option challenged by AI. While AI makes it easier to design DSPs, there are rising complexities due to the ...
IEEE

Mutual Decoupling for Massive MIMO Antenna Arrays by Using Triple-Layer Meta-Surface

Abstract: The high isolation massive antenna arrays are the key devices in the base station of the future wireless communication systems. The challenge for the array application is how to reduce the ...